LL has over 35 years in the semiconductor and electronics industries, from design engineering, platform technologies, marketing, business operations, managing global organizations and chief executive for technology start-ups until a brief retirement in 2016. LL began his career at Intel that spanned nearly 18 years on x86 microprocessors, embedded microcontrollers, network and communications technologies and as a general manager for Communications Infrastructure Group. He was a member of the Intel team that developed the original Universal Serial Bus (USB v1.0) technology and co-led the global adoption of computer peripheral interface standard in the 1990s. He holds one US patent in Universal Serial Bus technology.
Served on technical advisory, academic boards, and a guest lecturer for the technopreneurship workshops by The International Science, Technology and Innovation Center for South-South Cooperation (ISTIC), under the auspices of UNESCO held in Africa, Middle East, South America and Caribbean countries in 2010-2017. He has been on the board of public listed companies and start-ups.
Kalai Selvan Subramaniam Co-Founder & CEO View Profile >
Kalai Selvan Subramaniam
Co-Founder & CEO
Kalai Selvan Subramaniam has more than 32 years of experience in the electronics/semiconductor industry with leadership positions in Technology Start-Ups to Tier-1 Semiconductor MNCs. He is passionate in setting up organization from ground up. He has been instrumental in setting up local capabilities to provide value add E&E engineering services, especially in the area of Semiconductor IC Design and Product Development to Tier-1 Electronics and Semiconductor companies.
Prior to setting up Infinecs, Kalai was the General Manager of USains Infotech Sdn. Bhd. He started his career in Motorola Semiconductors and spent a total of 12 years with 3 years in Austin, Texas and 5 years in Singapore. Kalai joined start-up company in Malaysia; My-MS as the pioneer team. He led and set-up the IC Design capability from the ground up to develop Embedded & Security Memory SOCs. Kalai also worked at Intel Corp. for more than a decade in a Managerial and Leadership role in Oregon, USA, and Penang, Malaysia.
Kalai holds BEE (Hons) and MEng from UTM. He is a Senior Member of IEEE and active contributor to IEEE Malaysia section and chapters. He has held a number of executive portfolios in local IEEE section and chapters. He was the past Chair of the Malaysia IC Design Association (MICDA) and actively participates in the National Electronics industry development forums/committees, especially with regards to uplifting the Semiconductors and Electronics Design areas. Kalai serves on the Industry Advisory Panel of a number of local Universities. He is also appointed as Adjunct Professor in Engineering and Business Study at University Technology Malaysia, University Technology Petronas (UTP), and Universiti Malaysia Perlis (UniMAP).
PR Patel President and Head of US Operations View Profile >
PR Patel
President and Head of US Operations
Has more than 38 years of experience working in the industry with 25 years’ experience working at Intel Corporation in a variety of engineering and management positions.
Worked at various sites in USA, Germany, Japan, Malaysia and India.
Senior Member of IEEE.
Holds 18 US patents and recipient of 1st Ford Total Quality Excellence Award.
Bachelor and Masters Degree in Electrical Engineering from Michigan Technological University, Houghton.
Jennie has over 20+ years of IC Design expertise in project execution, inclusive of the past 12 years of technical lead for various IP Designs (PCIE, USB, LTE, GPU, PMIC). She is also an ACTA4.0 certified trainer with track record of technical training for notable MNCs. She has worked for Multi-National IC Design companies since year 2000 in the United Kingdom, Sweden, France, Singapore, and was offered The Returning Expert Program in Aug 2020. Jennie graduated with a First-Class Honors in Bachelor of Engineering (Electrical & Electronics), from University of Lincoln, United Kingdom. Her career kick-started in VLSI Design and progressively graduated with MSc in System-Level Design from University of Edinburgh, UK.
She joined Cadence in 2000, the leader of EDA in Livingston, Silicon Valley of Scotland and was working for the Design Services arm serving global customers: Infineon Germany, Mosaid Canada, Actel US, Philips UK. Completed projects were 180nm and 130nm process nodes for low-power routers, MIPs, networking and media processor.
In year 2004, she was the co-founder of MyMeth Ltd. UK, a provider of Design Services to on-site customers in the UK and Europe. Notable clients include Texas Instruments in Villenueve-Loubet, France; Infineon in Kista, Sweden; Imagination Technologies in Bristol, UK. The projects completed were Back-End implementation using Magma Blast Fusion and Primetime STA: 90nm PMIC, 65nm ARM GPU, 45nm UMTS-2G/3G (OMAP series).
She migrated back to Asia in year 2010 and worked for regional MNCs, Mediatek Spore then Intel Penang as senior Technical Lead. The projects completed were: Back-End implementation in process nodes 20nm, 16FF, 12nm for LTE, IMG & ARM GPU. She was also technical lead for design synthesis team to help close the gap between Front-End & Back-End PPA correlation (Power, Performance, Area), for PCIE4.0, USB2.0, CXL.
Apart from knowledge transfer, Jennie dedicates her time to mentoring and training graduates to be self-driven, future-ready engineers. Throughout the span of her career, Jennie has conducted VLSI training for over 500 engineers from Intel, Altera, Spansion, Aemulus, Avago, Honeywell, Qualcomm. She also mentored a team of 50 Intel engineers under the NCADD (Northern Corridor Analog & Digital Design) Masters Program.
Preemadesa Peyadesa Principal Technologist View Profile >
Preemadesa Peyadesa
Principal Technologist
Preemadesa has experience in Digital/Analog and RF Embedded System Design and manufacturing for over 22 years. Capable of Circuit Design, PCB board design and Software Coding, highlight on designing products with very low power consumption. Over the years he worked on products with various microprocessors from Texas Instrument, ST Micro, Atmel, Qualcomm and Motorola/Freescale. As an architect he has worked on the controller, power management, GPS-Glonass-Beidu, Wi-Fi, various sensors and user interface and connectivity, while defining the HDI PCB layout for up to 1 GHz frequencies
Got an early education in Penang Free School he went on and graduated with a Bachelor’s Degree in Electrical/Electronic from University Technology Malaysia, Johor.
Gain a wide industry career he started after graduation by joining a small Penang Based startup company called DMR that designs and manufactures Electronic Hygiene Products shipped worldwide, followed with a stint at Solectron Technology which was the largest PCB Assembly manufacturing at the time, for close to 15 years at Motorola Solutions developing mission critical 2-Way Radio Communications product, developed EE design team at Bose/Flex Batu Kawan for new customer’s Cisco, audio products.
He joined Infinecs Systems in 2021 with the goal of developing local talents and capabilities while gaining insight of microprocessor development from the platform that is offered by Infinecs. Based on supporting customer AMD he gained valuable exposure in the semiconductor and Personal/Server computing industry with the post silicone test validation of the latest AMD Server CPUs. Here he worked on high performance server processors, operating systems - Linux.
Preemadesa has also involved with Penang Science Cluster a Penang state initiative for developing technology into schools and local colleges, an industry Mentor for Inti College. He is also a committee with Penang Astronomy Society introducing Science to public. Apart of Technology, he is also a committee member with the Penang Masters Athletics and actively involved with athletics sports development in Penang. A qualified fitness trainer and champion athlete in the Masters category.
Dr. Harikrishnan Ramiah Consultant Technologist View Profile >
Dr. Harikrishnan Ramiah
Consultant Technologist
Harikrishnan Ramiah is currently a Professor at the Department of Electrical Engineering, University of Malaya, working in RFIC/RFEH design. He received his B.Eng(Hons), MSc and PhD degrees in Electrical and Electronic Engineering in Analog and Digital IC design from Universiti Sains Malaysia in 2000, 2003 and 2008, respectively. In the year 2003, he was with SiresLabs Sdn. Bhd, CyberJaya, Malaysia. In the year 2002, he was attached to Intel Technology Sdn. Bhd. Harikrishnan was the recipient of the Intel Fellowship Grant Award, 2000-2008.
Harikrishnan is the Director of the Centre of Industry Research 4.0 (CRI 4.0) and the Head of Analog, Digital & RF Research group at University of Malaya. His work involves providing expert solutions to the industry in the strength of IR 4.0. Through CRI 4.0, he regulates expert collaborative effort of the faculties in University of Malaya, outsourcing solutions to SMEs and MNCs. He had produced silicon verified IPs in Analog, RF and RFEH Integrated Circuit Design. With a reputable research output and solution, he has secured several international, national and industrial grants from 2014 to date. He serves as an Associate Editor of IEEE Access in a recognition towards his research credibility. He is a Chartered Engineer and a Fellow of Institute of Electrical Technology (IET). He is also a Professional Engineer registered under the Board of Engineers, Malaysia. He is a Senior Member of the Institute of Electrical and Electronics Engineers (IEEE) and a member of The Institute of Electronics, Information and Communication Engineers (IEICE). His research has resulted in several reputable technical publications in Electrical & Electronics Engineering. His main research interest includes Analog Integrated Circuit Design, RFIC Design, VLSI system design and RF/Piezoelectric/Thermal/Electromagnetic Energy Harvesting Power Management Module Design.
Dr. Arjuna Marzuki Consultant Technologist View Profile >
Dr. Arjuna Marzuki
Consultant Technologist
Dr Arjuna has technical Leadership experienced with 25 years of experience in IC Design industries, from 15 years of hands-on design and 10 years in Technical Consultancy in managing all aspects of technical adept at developing requirements, supporting manufacturing, and responsible technical operations leader with demonstrated accomplishments in the field.
Arjuna joined Hewlett-Packard as an R&D engineer in Wireless Semiconductor Division in 1997. His main jobs were to design radio frequency (RF) and radio frequency integrated circuit (RFIC) products (BiCMOS technology). Such products were high-frequency transistors, RF gain blocks, I/Q demodulator, numerous others.
He then later joined IC Microsystems Sdn. Bhd. as IC design staff engineer. Involved in designing 12/10/8 bits digital-to-analog converter ICs and family of RFIC devices. He also managed to secure MYR 3.5 million MGS fund for RFIC device research and development/commercialization.
He later joined Agilent Technologies as IC design engineer/manager in Optical Product Division. To lead the analog design group, to design operational amplifiers, bandgap circuits, data-converters, I/Os, Power-on reset, numerous others.
He has been granted 1 US patent and has developed more than 20 commercial products during his employment with Hewlett-Packard/Agilent Technologies and IC Microsystems.
From 2006-2013, Arjuna was involved in several companies such as C-RaD Technologies and USAINS Infotech as a director and a technical consultant. His involvement as technical/design manager in those companies has led to several successful products or businesses.
Arjuna was an associate professor at Universiti Sains Malaysia and engaged in analog integrated circuit courses at the undergraduate and postgraduate levels. He was also active in supervising Ph.D. students in the area of microelectronic research.
Arjuna has achieved considerable experience in project management and product commercialization with his passion in R&D or design.
Arjuna has written a book on CMOS Analog and Mixed-Signal Design: Practices and Innovation, published by CRC press/Taylor & Francis. The book suits senior undergraduates, graduates, researchers, and practicing engineers.
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